rau SMT ua cov nroj tsuag rau kev ua cov tin hlaws tshwm nyob rau hauv cov txheej txheem yog tsim nyog los daws, ib tug zoo SMT ua cov nroj tsuag yog ua lawv qhov zoo tshaj plaws kom tshem tawm tag nrho cov kev tsis xws luag.
Thawj kauj ruam yog kom paub qhov ua rau ntawm qhov teeb meem, SMT chip processing plant los soj ntsuam qhov ua rau cov tin hlaws tshwm.
Tin hlaws dai (solder beading) yog lo lus siv los paub qhov txawv ntawm ib hom tin pob uas yog tshwj xeeb rau cov khoom siv. Solder beading tshwm sim thaum lub solder paste collapses (slump) los yog nias tawm ntawm lub ncoo thaum ua. Thaum lub sij hawm reflow, solder paste yog cais los ntawm lub ntsiab tso nyiaj thiab sau nrog ntau muab tshuaj txhuam los ntawm lwm cov ntaub qhwv, los ntawm ib sab ntawm lub cev tivthaiv los ua cov hlaws loj, los yog seem hauv qab cov khoom. Solder hlaws tshem tawm cov haujlwm Solder hlaws tuaj yeem zam tau los ntawm kev saib xyuas thaum tsim los ntawm kev tsis tshem tawm ncaj qha li deb li sai tau.
I. Stencil
1. stencil qhib ncaj qha raws li qhov loj ntawm lub ncoo qhib yuav ua rau tin hlaws hauv cov txheej txheem nti.
2. thickness stencil tuab heev, ces, kuj tseem yuav ua rau lub cev qhuav dej ntawm lub solder muab tshuaj txhuam, yog li yuav kuj tsim tin hlaws dai.
3. SMTtshuabYog hais tias mount thaum lub siab siab dhau lawm, solder paste yog ib qho yooj yim rau kev nyem rau cov khoom hauv qab no cov txheej txheem solder, nyob rau hauv reflow soldering thaum lub solder paste melting khiav mus rau cov khoom nyob ib ncig ntawm lub tin hlaws dai.
II. Solder muab tshuaj txhuam
1. Lwm yam kev txiav txim siab solder paste tsis tempered nyob rau hauv lub preheating theem yuav tshwm sim nyob rau hauv lub spatter tshwm sim thiab yog li tsim tin hlaws dai.
2. Qhov me me ntawm cov hmoov hlau hlau nyob rau hauv cov tshuaj txhuam hniav, qhov loj dua ntawm qhov chaw ntawm qhov muab tshuaj txhuam yog qhov loj dua, uas ua rau muaj oxidation ntau dua ntawm cov hmoov zoo, yog li ua rau qhov tshwm sim ntawm cov hlaws hlaws.
3. Qhov siab dua ntawm oxidation ntawm cov hmoov hlau hauv cov tshuaj txhuam hniav, qhov siab dua ntawm cov hmoov hlau hmoov sib txuas thaum lub sij hawm soldering, qhov yooj yim rau infiltrate ntawm solder paste thiab lub ncoo thiab SMT chip Cheebtsam, yog li ua rau qis solderability.
4. Tus nqi ntawm cov flux thiab active solder ntau npaum li cas, nws yuav ua rau lub phenomenon ntawm lub zos vau ntawm lub solder muab tshuaj txhuam thiab yog li tsim tin hlaws dai, cov kev ua ntawm cov flux tsis txaus kom tshem tawm tag nrho cov oxidation ib feem tseem yuav ua tau. mus rau lub chip processing Hoobkas ua cov tin hlaws dai.
5. Cov ntsiab lus hlau hauv kev ua haujlwm tiag tiag ntawm kev siv cov khoom siv hlau nplaum dav dav hlau cov ntsiab lus thiab cov ntsiab lus zoo yog 88 feem pua rau 92 feem pua , ntim piv li ntawm 50 feem pua , nce cov ntsiab lus hlau tuaj yeem ua rau kev npaj cov hmoov hlau ua kom zoo dua, yog li uas nyob rau hauv lub melting yooj yim mus ua ke.
Nta ntawmNeoDen K1830 tuaj tos thiab tso tshuab
1. 8 Synchronized Nozzles uas ua kom muaj qhov rov ua tau qhov tseeb qhov tseeb nrog kev kub ceev.
2. Tshuab khiav ntawm qhov ruaj khov thiab ruaj ntseg Linux operating system.
3. Ethernet kev sib txuas lus interface rau tag nrho cov teeb liab sab hauv mus ncig ua rau lub tshuab ua haujlwm ruaj khov thiab yoog raws.
4. Kaw lub voj Servo tswj qhov system nrog kev tawm tswv yim ua rau lub tshuab ua haujlwm tau zoo dua.
5. PCB qhov chaw tuaj yeem ntsuas tau thiab ua kom sai, raws li qhov raug thiab tshwj xeeb thov.