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SMT Cov Ntawv Kho Mob Tsis Zoo

Feb 20, 2020

SMT Cov Ntawv Teev Tsis Zoo thiabSMT Cov Kev Daws Teeb Meem (SMT / SMD Cov Teeb Meem thiab Daws)

SMT (nto Mount Tshuab), zoo li lwm SMD Soldering thiab PCB sib dhos tshuab tsis yog ZERO-Defect soldering txheej txheem. Yuav muaj qee qhov lossis lwm qhov tsis xws luag hauv ib qho Electronics PCB sib dhos hauv Thru-Qhov thiab SMT.


Ntawm no kuv yuav los tham txog qee qhov kev txhaum ua feem ntau thiab ua rau SMT tsis xws luag thiab daws teeb meem thiab kev daws teeb meem.

Cov Teeb Meem Qub Hauv SMT:

  • Neeg ham khoom

  • Neeg tua neeg beading

  • Ntshai

  • Qhib- tsis txaus

  • Tojntxas

  • Unmelted muab tshuaj txhuam

  • Ntau cov lim tawm

  • Paab

  • Lwg

  • Kev sib txuam sib txuam

  • Txiv Kab Ntxwv

Cov Phwv Xaws Pob–Muaj peev xwm ua:

  1. Cov Kws Zov Me Nyuam Txhuam Muab tshuaj pleev xim rau sab hauv qab ntawm stencil.

  2. Squeegee siab yog dab tsi?

  3. Puas yog stencil underside ntxuav nrog cov kuab tshuaj thiab cov kuab tshuaj tseem tseem tshwm sim tom qab ntxuav?

  4. Puas yog stencil haum nrog PCB?

Kev daws rau Teeb Meem Pob Pob:

  1. Kos squeegee lub siab

    Solder balls = numerous tiny solder balls trapped along the outside edge of the flux residue

    Cov khoom tom pob=ntau cov pob me me uas muag rau sab nraud ntawm ntug qhov flux residue

  2. Kuaj rau qhov kom zoo gasketting thiab cov kho kom haum

  3. Kuaj xyuas yog tias cov kuab tshuaj tu kom yaj tag ua ntej luam tawm

Oxidised paste - Muaj peev xwm ua rau

  1. Puas yog muab tshuaj txhuam rau hauv tub yees?

  2. Puas yog muab tshuaj txhuam siv sijhawm ntev heev hauv thaj chaw kub?

  3. Puas yog qhov qub txhuam rov qab rau hauv lub thawv?

    Solder balls = numerous tiny solder balls trapped along the outside edge of the flux residue

    Cov khoom tom pob=ntau cov pob me me uas muag rau sab nraud ntawm ntug qhov flux residue

  4. Cov thawv puas tau muab tso rov qab rau hauv tub yees tom qab qhib?

  5. Puas yog alloy rhiab rau oxidation?

Kev daws rau Oxidised Solder Paste Teeb Meem:

  1. Khiav tshiab muab tshuaj txhuam los ntawm sib txawv ntau nyob rau hauv tib yam mob thiab saib yog cam cam ploj mus.

Oxidised paste - Muaj peev xwm ua rau

  1. Squeegee siab dhau

  2. Paste tau zuaj ntawm stencil thiab pawg thawj coj saib

Tshuaj: Txo qhov hnoos qeev

Muaj peev xwm ua:

  1. Kom qhuav tawm ntawm cov khoom tom qab luam ntawv

  2. Dab tsi yog teev tack lub sij hawm ntawm muab tshuaj txhuam?

Tshuaj: Khiav PCB tawm nrog tshiab muab tshuaj txhuam thiab pom tias qhov teeb meem ploj mus

Muaj peev xwm ua:

  1. Qeeb qeeb dhau los txhim kho nyob rau hauv reflow profile

Tshuaj: Khiav profile pom zoo thiab pom yog tias teeb meem nyob qis qis

Muaj peev xwm ua:

  1. Ntsia nrawm nrawm mus rau hauv qhov txaus profile

Tshuaj: Khiav ib qho khiav qeeb dua nce profile kom muab cov duab hluav taws xob tshem tawm

SOLDER BEADS - Muaj peev xwm ua:

  1. Reflow profile nruab nrab nce qeeb

    Solder beading : solder balls that are alongside a components

    Caj dab beading: ham pob uas nyob ntawm ib sab tivthaiv

  2. Capillary kev txiav txim tsis siv neeg muab tshuaj txhuam deb ntawm ncoo mus rau ib qhov twg hauv kev tivthaiv, nws reflows muaj thiab tsim cov hlaws ntawm solder uas tawm los ntawm sab hauv sab tivthaiv.

Tshuaj: Khiav ib txoj kab nrawm dua uas nthuav txog 1.5 Degree Celsius txog 2.5 Degree Celsius tauj ib ob.

Muaj peev xwm ua:

  1. Ntau dhau heev lawm ntawm ham muab tshuaj ntawm cov khoom tivthaiv

  2. Dab tsi yog stencil thickness?

  3. Puas yog apertures txo?

  4. Dispense lub sij hawm rau ib teev?

Tshuaj:

  1. Txo aperture qhov loj me ntawm stencil lossis siv stencil thinner

  2. Siv cov koob me me thiab / lossis txo lub sijhawm ntxuav hauv lub tshuab dispenser

Cov teeb meem uas tsim nyog: Muab tshuaj pleev xim rau sab hauv qab ntawm stencil

  1. Squeegee siab yog dab tsi?

  2. Puas yog stencil underside ntxuav nrog cov kuab tshuaj thiab cov kuab tshuaj tseem tseem tshwm sim tom qab ntxuav?

  3. Puas yog stencil zoo sib xyaw nrog PCB?

Tshuaj:

  1. Kos squeegee lub siab

  2. Kuaj rau qhov kom zoo gasketting thiab cov kho kom haum

  3. Kuaj xyuas yog tias cov kuab tshuaj tu kom yaj tag ua ntej luam tawm

CAB CEEV - Tej zaum ua rau:

  1. Mob khaub thuas

    Bridging = solder running from one component contact to another resulting in a short circuit

    Bridging=ham khiav ntawm ib qho kev tiv tauj mus rau lwm qhov tshwm sim hauv luv Circuit Court

  2. Yog muab tshuaj txhuam sib nrug tom qab luam ntawv, qhov siab ntawm tso nyiaj txo qis thiab nce saum npoo.

Tshuaj:

  1. Kos viscosity ntawm muab tshuaj txhuam, viscosity tsawg dhau yuav ua rau txias txias

  2. Kuaj qhov ceev, qhov nrawm tshaj tawm nrawm yuav ua rau shearing ntawm muab tshuaj txhuam thiab saib tsis tau nws tuab

  3. Tshawb xyuas qhov kub thiab txias hauv tshuab luam ntawv, qhov kub siab dhau los ua kom viscosity qis dua

    Bridging = solder running from one component contact to another resulting in a short circuit

    Bridging=ham khiav ntawm ib qho kev tiv tauj mus rau lwm qhov tshwm sim hauv luv Circuit Court

Qhov Ua Tau:

  1. Kub nqis

  2. Yog muab tshuaj ntws sib nrug thaum caij nruab nrab ib feem ntawm reflow profile

Tshuaj: Ua kom luv dua ntawm sij hawm nce nyob deb hauv voj voog nyob rau hauv reflow profile

Qhov Ua Tau:

  1. Muab cov smearing rau sab hauv qab ntawm stencil

  2. Muab tshuaj txhuam tuaj yeem sab nraum lub ncoo thaj tsam thiab daim ntawv pob cov khoom ntawm ob qho kev coj ua uas ua rau muaj tus choj

TshuajTxo cov hnoos qeev thiab tshawb xyuas pcb-stencil sib xyaw thiab gasketting

Qhov Ua Tau:

  1. Tshaj li qhov muab tshuaj txhuam muab tso rau ntawm cov ntaub qhwv

  2. Thaum muab cov tshuaj tivthaiv tso rau ntawm cov ntaub qhwv cov tshuaj txhuam yog smeared tawm thiab tuaj yeem tsim tus choj rau ntawm cov ncoo uas nyob ib sab

Kev kho kom sov:

  1. Txo cov nyiaj ntawm ham muab tshuaj txhuam

  2. Tuaj yeem luam tawm ceev

  3. Txo cov stencil tuab

Qhib-tsis txaus–Muaj peev xwm ua:

Opens and insufficient = insufficient or no solder to make a complete bond between the lead and the pad

Qhib thiab tsis txaus=tsis txaus lossis tsis muaj cam txaus kom muaj kev sib koom ua tiav ntawm cov txhuas thiab cov ncoo

  1. Scooping thaum luam ntawv

  2. Txoj kev cia siab ntau dhau ntawm ib qho polypropylene squeegee tuaj yeem ua rau scooping

Tshuaj:Txo cov nyem squeegee lossis siv cov durometer uas nyuaj dua los ntawm kev nqus lossis siv hlau txias

Cov Teeb meem Ua Tau: Txhawm ntawm stencil aperture nrog qhuav muab tshuaj txhuam

Kev kho kom sov: Txhob thaiv apertures thiab stencil huv

Qhov Ua Tau:

Opens and insufficient = insufficient or no solder to make a complete bond between the lead and the pad

Qhib thiab tsis txaus=tsis txaus lossis tsis muaj cam txaus kom muaj kev sib koom ua tiav ntawm cov txhuas thiab cov ncoo

  1. Txawv teb chaws cov khoom ntawm cam ncoo

  2. Puas yog daim npog ntsej muag tau luam tawm ntawm cov ntaub qhwv?

Tshuaj:Siv lwm tus PCB

Qhov Ua Tau:

  1. Muaj zog ceev ceev dhau

  2. Muab tshuaj txhuam tsis tuaj yeem nkag rau hauv apertures

Kev kho kom sov: Txo qhov hnoos qeev

Muaj peev xwm ua: Cov pas nrig muab tshuaj viscosity thiab / lossis hlau cov ntsiab lus tsawg dhau

Kev kho kom sov: Tshawb cov viscosity thiab cov ntsiab lus hlau

THEM TXIM

Tombstoning = chip type components standing up on one end after reflow caused by unequal forces on the components end

Tombstoning=chip type Cheebtsam sawv ntawm ib qho kawg tom qab reflow tshwm sim los ntawm kev tsis sib xws ntawm cov tub rog ntawm lub Cheebtsam kawg

Muaj peev xwm ua: Qhov tsis zoo tso ntawm cov khoom ntawm cov ntaub qhwv ua ntej Rho txiaj ntsig ua rau muaj kev tsis txaus ntseeg lub zog quab yuam.

Kev kho kom sov: Txheeb xyuas yog tias tso cov khoom tso rau kom yog.

Muaj peev xwm ua: Cov cua kub uas tsis sib xws txhais tau tias hauv tshav dav hlau hauv PCB txheej yuav nqus cua sov ntawm ncoo.

Kev kho kom sov: Txo cov sij hawm soak (toj siab) los yog reflow profile kom txhua qhov sib tov.

UNMELTED MUAB–Muaj peev xwm ua:

  1. Yuav kom txias reflow profile

  2. Cov hlaws dai tsis yaj tag

Unmelted paste = paste shows characteristics of powder after reflow, joints are dull not shiny. May be on some components only

Unmelted paste=muab tshuaj txhuam qhia cov yam ntxwv ntawm cov hmoov tom qab reflow, cov pob qij txha yuav tsis npub tsis ci. Yuav nyob ntawm tej cheebtsam nkaus xwb

Kev kho kom sov: Tshawb xyuas daim ntawv qhia qhov tseeb, nco ntsoov tias lub sijhawm kub thiab lub sijhawm siab dua cov kua dej (183 C) kom siab txaus thiab xau (toj siab) ntev ntev.

Unmelted paste = paste shows characteristics of powder after reflow, joints are dull not shiny. May be on some components only

Unmelted paste=muab tshuaj txhuam qhia cov yam ntxwv ntawm cov hmoov tom qab reflow, cov pob qij txha yuav tsis npub tsis ci. Yuav nyob ntawm tej cheebtsam nkaus xwb

Sab Sij Huam Ntshav Qab Zib

Muaj peev xwm ua: Ntau dhau los cam muab tshuaj tso rau ntawm cov ntaub qhwv

Tshuaj:

  1. Yog hais tias muaj ntau heev tshwm sim rau tag nrho cov cheeb tsam txo tag nrho stencil thickness lossis txo dispenser purge sij hawm

  2. Yog tias muaj ntau tus cam tshwm sim rau qee qhov chaw tsuas yog txo qis stencil thickness lossis dispense purge lub sijhawm rau cov cheebtsam no nkaus xwb

Excessive fillet = bulbous appearance of joint where outlines of the leads are obscured by the quantity of solder on them

Ntau dhau fillet=bulbous tsos ntawm sib koom tes qhov twg qhia ntawm cov ua yog obscured los ntawm qhov ntau ntawm ham rau lawv

PaabMob khaub thuas–Muaj peev xwm ua:

Viscosity ntawm muab tshuaj txhuam rau cov ntsiab lus tsawg los yog hlau kom tsawg

Slump = deformation of paste deposit after printing or dispensing deposit height will reduce while surface expands

Npleem=deformation ntawm cov nyiaj tso tawm tom qab luam ntawv lossis xa qhov siab tso nyiaj qhov siab yuav txo thaum nto nthuav dav

Kev kho kom sov: Siv qhov sib txawv ntawm qhov sib txawv nrog ntau dua viscosity lossis cov ntsiab lus hlau ntau dua

Muaj peev xwm ua: Paste tuaj rau hauv kev sib cuag nrog cov kuab tshuaj ntxuav tu lossis lwm yam khoom txawv txawv

Tshuaj:

  1. Nco ntsoov tias tsis muaj cov kuab tshuaj nthuav qhia tom qab ntxuav lub vijtsam

  2. Tsis txhob sim thim rov qab qhov muab tshuaj los ntawm kev ntxiv qee qhov sib xyaw

Muaj peev xwm ua:

Slump = deformation of paste deposit after printing or dispensing deposit height will reduce while surface expands

Npleem=deformation ntawm cov nyiaj tso tawm tom qab luam ntawv lossis xa qhov siab tso nyiaj qhov siab yuav txo thaum nto nthuav dav

  1. Squeegee siab mus rau qhov siab

  2. Kev muab tshuaj txhuam txiav tau vim yog siab dhau thov rau nws cov tuab hauv qhov muab tshuaj txhuam pov tseg

Kev kho kom sov: Siv cov ntawv tso tawm tshiab thiab txo qhov hnoos siab

Muaj peev xwm ua: Qhov kub ntawm muab tshuaj txhuam yog siab dhau heev thaum luam ntawv lossis xa tawm

Tshuaj:

  1. Kuaj kub hauv tshuab luam ntawv

  2. Txo kev ntxhov siab rau squeegee

  3. Txo rau lub siab ntawm cov koob txhaj tshuaj thaum muab faib

Kub muag

Muaj peev xwm ua: Qeeb dhau los nce nyob rau hauv reflow profile

Kev kho kom sov: Ua kom lub zog nce nyob rau qhov kub thiab txias, nco ntsoov muaj qhov nruab nrab ntawm 2 Degree Celsius mus rau 3 Qib Celsius ib pliag

DEJ TXUJ CI–Muaj peev xwm ua:

Dewetting = bad attachment of molten solder to surface

Dewetting=tsis zoo txuas ntawm molten solder mus rau saum npoo

  1. Kev tsis siv khoom tsis zoo nyob rau saum npoo uas tiv thaiv kom tsis txhob muaj tshuaj mus rau saum npoo av, piv txwv li daim npog ntsej muag, ntiv tes ntiv tes los yog oxides.

Tshuaj:

  1. Ntxuav cov laug cam ua ntej

  2. Siv cov pob sib txawv ntawm cov laug cam

Muaj peev xwm ua:

Dewetting = bad attachment of molten solder to surface

Dewetting=tsis zoo txuas ntawm molten solder mus rau saum npoo

  1. Cov xaim tsis zoo nyob rau hauv HAL cov txheej txheem, piv txwv li ntau dhau Cu txhawb siab melting taw tes ntawm HAL alloy

tshuaj:

  1. Ua kom qhov kub siab kawg hauv reflow

  2. Siv cov pob sib txawv ntawm cov laug cam

Muaj Kev Sib Koom SiabMuaj peev xwm ua:

Ib qhov chaw ntawm kev vibration uas kis tau los ntawm pcb thaum lub sijhawm ua kua hauv lub xeev ntawm qhov reflow profile

Tshuaj:

  1. Nrhiav thiab kho qhov chaw ntawm kev co

  2. Kho reflow

Disturbed Joint = dull, rough appearance of solder in an alloy that is normally bright and shiny

Kev Sib Koom Tes=lub npub, zoo li pom zoo ntawm solder hauv ib qho alloy uas ib txwm muaj ci thiab ci

Tawv txiv kab ntxwv–Muaj peev xwm ua:

Orange skinning = dull, rough appearance of solder, joint texture is orange skin like

Txiv kab ntxwv tawv nqaij=npub, zoo li pom zoo li solder, kev sib koom ua ke yog txiv kab ntxwv tawv nqaij zoo li

  1. Ntau dhau hauv cheeb tsam siab

  2. Qhov chaw nyob hlawv lossis rosin ua noj

Tshuaj:

  1. Txo qhov chaw siab tshaj qhov kub thiab txias

Muaj peev xwm ua:

  1. Ntev raug rau kub ntawm kev ua kom sov thiab reflow=(nyob ntawm alloy)

Tshuaj:

Orange skinning = dull, rough appearance of solder, joint texture is orange skin like

Txiv kab ntxwv tawv nqaij=npub, zoo li pom zoo li solder, kev sib koom ua ke yog txiv kab ntxwv tawv nqaij zoo li

  1. Ua kom lub sijhawm hauv qis dua lossis tsis txhob sov thiaj sov

Muaj peev xwm ua:

  1. Preheating dhau lawm

Tshuaj:

  1. Kev ntsuas kub qis dua kom sov

NeoDen muab afullsmt los ua ke lineolutions, xws liSMTreflow cub, yoj soldering tshuab, khaws thiab qhov chaw tshuab, cam muab tshuaj txhuam tshuab luam ntawv, PCB loader, PCB unloader, nti mounter, SMT AOI tshuab, SMT SPI tshuab, SMT X-Ray tshuab, SMT los ua ke kab khoom, PCB khoom siv ntau lawmsmt seem khoomlwm yam zoo li SMT tshuab koj yuav xav tau, thov hu rau pebyog xav paub ntxiv:

Hangzhou NeoDen Technology Co., Ltd

Ntxiv: Lub Tsev 3, Diaoyu Industrial thiab Technology Park, No.8-2, Keji Avenue, Yuhang District, Hangzhou，Tuam Tshoj

Tiv toj rau peb: Steven Xiao

Xov tooj: 86-18167133317

Fax mus: 86-571-26266866

Skype：toner_cartridge

E-mail:steven@neodentech.com

E-mail:info@neodentech.com


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