Circuit board nto bubbling yog qhov teeb meem ntawm qhov tsis zoo ntawm qhov sib khi quab yuam, thiab tom qab ntawd txuas ntxiv yog qhov zoo ntawm lub rooj tsavxwm, uas muaj ob yam:
1.Qhov kev huv ntawm lub rooj tsavxwm.
2.Surface micro roughness (los yog nto zog) teeb meem.
Tag nrho cov board nto bubbling teeb meem ntawm PCBboard tuaj yeem raug sau tseg raws li qhov ua rau saum toj no.
Kev sib khi quab yuam ntawm cov txheej txheej tsis zoo los yog tsawg dhau, thiab nws yog ib qho nyuaj rau kev tiv thaiv txheej txheej kev ntxhov siab, kev ntxhov siab thiab thermal stress generated hauv kev tsim khoom thiab kev ua haujlwm hauv cov txheej txheem tom ntej thiab kev sib dhos, thiab thaum kawg ua rau kev sib cais ntawm qhov sib txawv. degrees nruab nrab ntawm cov txheej.
1.Qhov teeb meem ntawm kev ua cov khoom siv hauv paus
Tshwj xeeb tshaj yog rau qee qhov nyias nyias (feem ntau hauv qab 0.8mm), vim tias lub substrate rigidity tsis zoo, nws tsis haum rau txhuam lub phaj tshuab. Yog li tej zaum yuav tsis muaj peev xwm tshem tawm cov substrate kom tsis txhob muaj qhov oxidation ntawm tooj liab ntawv ci nyob rau hauv cov txheej txheem ntawm kev tsim thiab ua thiab txheej txheej tshwj xeeb, thaum txheej txheej nyias nyias, txhuam phaj yog yooj yim tshem tawm, tab sis cov tshuaj ua haujlwm nyuaj. , yog li cov lus ceeb toom tseem ceeb hauv kev tsim khoom thiab kev tswj xyuas, tsam ua rau lub vaj huam sib luag substrate tooj liab ntawv nyiaj thiab tooj liab tshuaj sib txuas quab yuam ntawm cov npuas npuas los ntawm qhov phem; Qhov teeb meem no nyob rau hauv nyias txheej txheej ntawm cov xim dub, yuav muaj cov xim dub tsis zoo, xim tsis sib xws, cov xim dub hauv zos tsis yog cov teeb meem thawj zaug.
2. qhov chaw nyob rau hauv machining (drilling, lamination, milling, thiab lwm yam) tshwm sim los ntawm cov txheej txheem ntawm cov roj los yog lwm yam kua plua plav paug deg kev kho mob tsis zoo tshwm sim.
3.Txheej tooj liab txhuam phaj
Lub siab ntawm cov phaj sib tsoo ua ntej tooj liab nag lossis daus loj heev, ua rau deformation ntawm lub qhov ncauj, thiab cov ntawv ci tooj liab sib npaug thiab txawm tias lub substrate leakage ntawm lub qhov ncauj yog txhuam tawm, yog li lub orifice foaming tshwm sim yuav tshwm sim nyob rau hauv tus txheej txheem ntawm tooj liab nag lossis daus electroplating thiab tin-txhaj vuam vuam. Txawm hais tias cov txhuam hniav tsis ua rau cov dej ntws tawm, cov txhuam hniav ntau dhau yuav ua rau cov roughness ntawm tooj liab ntawm lub qhov ncauj, yog li nyob rau hauv cov txheej txheem ntawm micro-etching thiab coarsening, cov ntawv ci tooj liab yog ib qho yooj yim los tsim ntau coarsening tshwm sim, thiab yuav muaj. ua ib qho kev zoo zais teeb meem; Yog li ntawd, yuav tsum tau them nyiaj mloog mus ntxiv dag zog rau kev tswj cov txheej txheem txhuam phaj, txhuam phaj txheej txheem tsis tuaj yeem hloov kho kom zoo tshaj plaws los ntawm kev hnav cov cim ntsuas thiab ntsuas dej.
4. Kev ntxuav dej
Xav tau vim tias qhov hnyav tooj liab electroplating ua los ntawm ntau cov tshuaj ua kua tshuaj ua haujlwm, txhua yam ntawm cov kua qaub-puag cov organic hnyav xws li tshuaj, board lub ntsej muag ntxuav tsis huv, tshwj xeeb tshaj yog hnyav tooj liab hloov ntxiv rau cov neeg ua haujlwm, tsis tsuas yog tuaj yeem ua rau muaj kev sib kis kab mob sib kis, kuj yuav ua rau lub rooj tsavxwm ntsib kev ua haujlwm hauv zos tsis zoo lossis kev kho mob tsis zoo, qhov tsis zoo ntawm qhov tsis sib xws, ua rau qee qhov kev sib khi quab yuam; Yog li ntawd, peb yuav tsum tau ua tib zoo saib xyuas kom muaj zog ntawm kev tswj cov dej ntxuav, feem ntau suav nrog kev tswj xyuas cov dej huv, dej zoo, lub sij hawm ntxuav dej, thiab lub sij hawm poob ntawm cov phaj thiab lwm yam; Tshwj xeeb tshaj yog nyob rau lub caij ntuj no thaum qhov kub thiab txias tsis tshua muaj, cov nyhuv ntawm kev ntxhua khaub ncaws yuav txo qis heev, thiab yuav tsum tau them nyiaj ntau dua rau kev tswj kev ntxuav.
