Taw qhia
Nyob rau hauv siab -kawg tsim sector ntawm PCBA ua, engineers nquag ntsib ib qho kev sib tw tseem ceeb: raws li cov khoom siv hluav taws xob hloov mus rau thinner, sib zog tsim thiab ntau dua kev koom ua ke, BGAs, QFNs, thiab CSPs (Chip- Scale Packages) tau dhau los ua ib qho chaw ntawm Circuit Boards. Tag nrho cov pob qij txha nyob rau hauv cov pob no yog nyob rau hauv qab lub nti nto. Kev tshuaj xyuas qhov muag pom ib txwm thiab txawm tias qib siab AOI kho qhov muag pom tau ua pov thawj tsis muaj txiaj ntsig tiv thaiv cov khoom encapsulations.
Txhawm rau pom los ntawm cov pob opaque no thiab ntsuam xyuas kev ncaj ncees, X-ray tsis yog-kev kuaj kev puas tsuaj tau dhau los ua qhov tsis tseem ceeb X-ray tsis pom kev ntawm cov kab ntau lawm. Raws li ib tug tub rog kev lag luam nrog ntau xyoo ntawm kev paub nyob rau hauv pem hauv ntej kab ntawm PCBA zoo tswj, kuv paub tias tsis muajX-kev soj ntsuam kab hluav taws xob, ib qho kev cog lus ntawm "kev ntseeg siab" tseem tsis muaj dab tsi tab sis lub tsev fuabtais saum huab cua.
I. Kev Tshawb Fawb Txog X-Ray Imaging
Lub hauv paus ntsiab lus ntawm X-ray tshuaj ntsuam zoo ib yam li tsev kho mob X-rays. Nws siv qhov sib txawv ntawm qhov sib txawv ntawm X-rays thaum lawv dhau los ntawm cov khoom sib txawv ntawm qhov sib txawv, tsim qhov sib piv- cov duab nplua nuj ntawm lub phaj photosensitive. Nyob rau hauv Circuit Court boards, qhov ceev ntawm hlau solder (tin, lead, silver) deb tshaj ntawm cov PCB substrate thiab yas pob casing.
Raws li rays traverse lub rooj tsavxwm, solder sib koom contours tshwm sharply txhais ntawm qhov screen. High-zoo X-ray duab tso cai rau peb tev txheej rov qab zoo li dos, tshuaj xyuas lub ntiaj teb microscopic hauv qab ICs. Qhov no hla tsuas yog kev tshuaj ntsuam xyuas-nws yog kev phais- qib scan rau kev tsim khoom tsis zoo.
II. Quantitative Analysis ntawm BGA Solder Joint Voiding
Hauv BGA soldering, voids yog qhov kev dag ntxias tshaj plaws. Cov npuas no nyob rau hauv cov pob qij txha, feem ntau dhau kev xeem hluav taws xob sab nraud (ICT lossis FCT) yam tsis muaj teeb meem. Txawm li cas los xij, thaum lub sijhawm ua haujlwm ntev - lub sijhawm ua haujlwm, voids ua rau muaj kev cuam tshuam rau lub zog thiab thermal conductivity ntawm cov sib koom ua ke, thaum kawg ua rau qaug zog tawg.
Los ntawm X-ray lub peev xwm ua kom pom tseeb, peb tuaj yeem pom qhov pom qhov loj thiab qhov chaw ntawm cov npuas hauv cov khoom siv. Cov kws tshaj lij kev soj ntsuam software tuaj yeem txiav txim siab qhov feem pua ntawm qhov chaw tsis muaj qhov cuam tshuam rau tag nrho thaj chaw sib koom ua ke. Yog tias tus nqi tsis muaj zog tshaj li IPC tus qauv pib ntawm 25% (lossis nruj dua tsheb / kho mob- cov qauv), peb yuav tsum tshuaj xyuas seb qhov reflow qhov cub qhov kub ntawm qhov profile yog qib lossis yog tias cov tshuaj nplaum cov ntsiab lus tsis hloov pauv ntau dhau. Qhov kev tswj kom muaj nuj nqis no sawv cev rau lub cim ntawm kev paub tab PCBA kev tsim khoom zoo.
III. Kev txheeb xyuas "Bridging" thiab "Cold Solder Joints": Ntau- Kev Ntsuam Xyuas Txheej Txheem
Tshaj qhov tsis muaj dab tsi, X- kev tshuaj xyuas kab hluav taws xob ua pov thawj muaj zog sib npaug hauv kev kuaj xyuas luv luv (bridges) thiab cov pob qij txha txias (qhib / txias solder). Rau QFN cov pob khoom nrog cov ntaub ntawv luv luv, kev sib txuas feem ntau tshwm sim hauv cov txheej txheem hauv qab. X-ray kom meej meej ntes cov duab ntxoov ntxoo ntawm cov hlau ntau dhau ntawm cov ntaub qhwv.
Qhov nyuaj dua yog "Lub taub hau-hauv-Phi" nyhuv. Qhov no tshwm sim thaum cov khoom siv sib txuas nrog cov khoom sib txuas tsis muaj melting tag nrho, tsim kev sib txuas tsis raug zoo li lub taub hau so ntawm lub hauv ncoo. Kev tshuaj xyuas ib txwm muaj teeb meem los xyuas qhov no, tab sis qaij-lub kaum sab xis 3D X-ray duab qhia pom cov kab nrib pleb thiab cov geometries tsis tu ncua ntawm qhov sib txuas sib txuas, ua kom pom tseeb cov kev tsis zoo no.
IV. Qhov "Thawj Scene" ntawm Kev Tshawb Fawb Tsis Ua Haujlwm
Thaum lub sij hawm tsim khoom los yog tsis ua hauj lwm tsom xam, X-ray technology proves irreplaceable. Thaum lub rooj tsavxwm xa rov qab tuaj txog ntawm lub rooj, peb tuaj yeem tshawb xyuas cov kab sib txuas sab hauv kom tawg lossis tshuaj xyuas seb IC cov xov hlau puas tau deformed lossis snapped vim thermal shock-txhua yam tsis muaj kev puas tsuaj.
Qhov no tsis yog - muaj peev xwm ua kom puas tsuaj khaws cov pov thawj tseem ceeb tshaj plaws ntawm kev ua tsis tiav rau cov kws ua haujlwm, txhim kho cov hauv paus ua rau kev soj ntsuam kev ua tau zoo. Hauv cov chaw tsim khoom PCBA niaj hnub no, X-ray ua haujlwm tsis yog tsuas yog ua tus neeg soj ntsuam zoo xwb tab sis kuj yog cov ntaub ntawv tseem ceeb rau kev txhim kho cov txheej txheem.
Hauv qhov siab -kev tsim khoom siv hluav taws xob muaj tseeb, qhov tsis pom kev tsis zoo ua rau muaj kev phom sij txaus ntshai tshaj plaws. X-ray tsis yog-kev kuaj kev puas tsuaj txhim kho txoj kab kev tiv thaiv zoo, ua kom txhua tus IC tus pin yog soldered nrog uncompromising ncaj ncees thiab purity.
Cov ntaub ntawv ceevhais txog NeoDen
1) Tsim los ntawm 2010, 200 + cov neeg ua haujlwm, 27000+ Sq.m. Hoobkas.
2) NeoDen Cov Khoom: Cov tshuab sib txawv Series PnP, NeoDen YY1, NeoDen4, NeoDen5, NeoDen K1830, NeoDen9, NeoDen N10P. Reflow Cub IN Series, nrog rau ua tiav SMT Kab suav nrog txhua yam khoom siv SMT tsim nyog.
3) Ua tiav 10000+ cov neeg siv khoom thoob plaws ntiaj teb.
4) 40+ Cov Neeg Sawv Cev Thoob Ntiaj Teb muaj nyob hauv Asia, Europe, America, Oceania thiab Africa.
5) R&D Center: 3 R&D departments nrog 25+ kws R&D engineers.
6) Sau nrog CE thiab tau txais 70+ patents.
7) 30+ kev tswj xyuas zoo thiab kev txhawb nqa engineers, 15+ kev muag khoom loj thoob ntiaj teb, rau cov neeg siv khoom teb raws sijhawm hauv 8 teev, thiab cov kev daws teeb meem kev tshaj lij hauv 24 teev.