Taw qhia
Thaum lub sij hawm PCBA raug soj ntsuam zoo, muaj ntau yam tsom ntsoov rau kev sib koom ua ke kev pab cuam thaum saib xyuas cov hlab ntsha ntsug faus rau hauv pawg thawj coj saib xyuas: vias thiab dhau los ntawm - qhov. Lub plated tooj liab thickness nyob rau hauv cov qhov no tsim lub hauv paus rau hluav taws xob teeb liab kis tau tus mob thiab thermal shock kuj nyob rau hauv multilayer boards. Yog hais tias lub thickness ntawm tooj liab tsis ua raws li cov qauv, cov khoom yuav ua rau muaj kev cuam tshuam rau kev puas tsuaj thaum lub sij hawm kev pab cuam, ua rau tsis ua hauj lwm hauv Circuit Court.
IPC Standards: Tsim nyog Benchmarks rau tooj liab Thickness nyob rau hauv qhov
Hauv kev lag luam PCBA, peb feem ntau ua raws li IPC -6012 tus qauv los ntsuas qhov zoo ntawm plating hauv qhov. Rau General Class 2 circuit boards, qhov nruab nrab tooj liab tuab ntawm lub qhov phab ntsa yuav tsum ncav cuag 20μm, tsis muaj taw tes poob qis dua 18μm. Rau Chav Kawm 3 boards uas muaj kev nyab xeeb lub neej los yog high-end industrial tswj daim ntaub ntawv, qhov nruab nrab tooj liab thickness yuav tsum tau nce mus rau 25μm los yog siab dua.
Qhov no thickness specification tsis yog arbitrary. Los ntawm - qhov ua siab ntev ntau qhov siab - qhov kub thiab txias thaum lub sij hawm soldering (feem ntau nyob ib ncig ntawm 260℃). Txij li thaum PCB substrate (FR-4) nthuav tawm qhov thermal expansion coefficient ntau dua li tooj liab raws li Z-axis, lub qhov phab ntsa tiv taus qhov hnyav tensile. Yog tias cov txheej tooj liab nyias dhau lawm, nws cov ductility tsis tuaj yeem them nyiaj rau qhov kev nthuav dav ntawm lub cev, ua rau cov pob txha tawg-ntau zoo li cov hlua khi hlua khi.
Kev them nyiaj yug lub cev rau kev tiv thaiv kev tiv thaiv thiab muaj peev xwm nqa tam sim no
Rau PCBA nqa cov khoom siv hluav taws xob siab lossis siab -ntau zaus cov cim, cov tooj liab tuab nyob rau hauv qhov ncaj qha cuam tshuam rau impedance sib xws. Thinner tooj liab tsub kom qhov sib npaug ntawm qhov tsis kam, ua rau ntxiv qhov tso tawm thiab kub nce thaum lub sijhawm ua haujlwm siab - zaus.
Hauv cov xwm txheej ua tau zoo, cov pob me me tshwm sim los ntawm qhov tsis sib xws ntawm cov phab ntsa ntawm phab ntsa ua hotspots thaum lub sijhawm ua haujlwm siab tshaj plaws. Localized overheating ntxiv accelerates qaug zog degradation ntawm cov tooj liab txheej, tsim ib tug vicious voj voog uas thaum kawg induces phab ntsa tawg los yog disconnection ntawm puab txheej kab. Hla -section tsom xam qhia tias cov txheej txheem plating zoo tshaj plaws kom ntseeg tau tias qhov sib txawv ntawm tooj liab thickness tsawg heev los ntawm lub qhov ntug mus rau qhov chaw nruab nrab -ib qho tseem ceeb rau kev tswj cov teeb liab kev ncaj ncees.
Txheej Txheem Txheej Txheem: Qhov Phab Ntsa Erosion thiab Plating Voids
Thaum lub sij hawm pem hauv ntej -kawg lamination thiab drilling theem ntawm PCBA ua, tsis tiav Desmear residue tshem tawm tuaj yeem tso cov resin deposits ntawm qhov sib txuas nruab nrab ntawm cov txheej txheej sab hauv thiab cov tooj liab plating nyob rau hauv lub qhov, ua rau muaj kev tiv thaiv ntau dhau.
Qhov tseem ceeb tshaj, plating voids yuav tshwm sim. Kev siv tshuaj tsis txaus thaum lub sij hawm Plated Through Hole (PTH) txheej txheem los yog cov npuas cua hauv lub qhov tuaj yeem ua rau thaj tsam tooj liab txheej tsis xws luag ntawm phab ntsa ntawm lub qhov. Thaum cov kev tsis zoo no tuaj yeem dhau lub Hoobkas ICT kev sim txuas ntxiv, lawv tuaj yeem hloov mus rau hauv cov ntsiab lus pib tawg nyob rau hauv thermal cycling tej yam kev mob thaum siv tiag tiag. Qhov tsis ua haujlwm latent no yog npau suav phem hauv kev kho mob thiab tsheb hluav taws xob, tiv thaiv tsuas yog los ntawm kev saib xyuas cov txheej txheem nruj thiab hla -section sampling.
Reliability Validation: Thermal Shock thiab Metallographic Sections
Kev paub tseeb tias cov tooj liab tuab hauv PCBA qhov ua tau raws li cov lus qhia tshwj xeeb tsis tuaj yeem tso siab rau ntawm PCB cov chaw tsim khoom daim ntawv pov thawj ntawm kev ua raws cai. Rau cov haujlwm tseem ceeb, peb xav tau ntau qhov kev ntsuas thermal shock los simulate qhov chaw pabcuam huab cua. Ua ke nrog kev tsom xam ntawm metallographic, peb tuaj yeem ntsuas qhov tuab ntawm tooj liab txheej ntawm qhov chaw nruab nrab ntawm lub qhov, qhov qhov ncauj, thiab cov ces kaum hauv lub tshuab ntsuas. Qhov no tso cai rau kev soj ntsuam ntawm intermetallic compound (IMC) txheej txheej kev loj hlob thiab tshawb pom ntawm "wrinkling" tshwm sim ntawm lub qhov phab ntsa. Qhov kev txheeb xyuas ntau npaum li cas yuam PCB cov khoom lag luam txhawm rau txhim kho cov tshuaj lom neeg ruaj khov thiab sib xws ntawm kev faib tawm tam sim no. Kev sib xyaw tooj liab tuab hauv qhov tsis tsuas yog tiv thaiv cov txheej txheem soldering tab sis kuj ua raws li kev tuav pov hwm xauv rau kev sib txuas hluav taws xob thoob plaws hauv cov khoom lag luam tag nrho lub neej.
Lub qhov tooj liab tuab yog qhov pom tsis pom Great Wall hauv PCBs. Yog tias koj cov khoom muaj kev cuam tshuam ntau zaus hauv kev vibration lossis kub hloov pauv, lossis yog tias tsis tau piav qhia txog kev tawg tshwm sim thaum lub sijhawm kuaj kev laus, qhov no yuav tshwm sim los ntawm qhov tsis xws luag hauv cov txheej txheem phab ntsa ntawm PCB substrate.
Cov ntaub ntawv ceevhais txog NeoDen
1) Tsim los ntawm 2010, 200 + cov neeg ua haujlwm, 27000+ Sq.m. Hoobkas.
2) NeoDen Cov Khoom: Cov tshuab sib txawv Series PnP, NeoDen YY1, NeoDen4, NeoDen5, NeoDen K1830, NeoDen9, NeoDen N10P. Reflow Cub IN Series, nrog rau ua tiav SMT Kab suav nrog txhua yam khoom siv SMT tsim nyog.
3) Ua tiav 10000+ cov neeg siv khoom thoob plaws ntiaj teb.
4) 40+ Cov Neeg Sawv Cev Thoob Ntiaj Teb muaj nyob hauv Asia, Europe, America, Oceania thiab Africa.
5) R&D Center: 3 R&D departments nrog 25+ kws R&D engineers.
6) Sau nrog CE thiab tau txais 70+ patents.
7) 30+ kev tswj xyuas zoo thiab kev txhawb nqa engineers, 15+ kev muag khoom loj thoob ntiaj teb, rau cov neeg siv khoom teb raws sijhawm hauv 8 teev, thiab cov kev daws teeb meem kev tshaj lij hauv 24 teev.