Lub hom phiaj tseem ceeb tshaj plaws ntawm kev kho saum npoo yog los xyuas kom zoo solderability lossis hluav taws xob khoom. Raws li tooj liab nyob rau hauv cov xwm txheej zoo li muaj oxide nyob rau hauv cov huab cua thiab tsis zoo li yuav nyob twj ywm li nkauj xwb tooj liab rau lub sij hawm ntev, lwm yam kev kho rau tooj liab yuav tsum tau. Txawm hais tias muaj zog flux tuaj yeem siv los tshem tawm feem ntau cov tooj liab oxides hauv cov rooj sib txoos tom ntej, cov flux muaj zog nws tus kheej tsis yooj yim tshem tawm, yog li kev lag luam feem ntau tsis siv cov flux muaj zog.
Tam sim no muaj ntau cov txheej txheem kho PCB nto, feem ntau yog huab cua kub leveling, organic txheej, tshuaj npib tsib xee / immersion kub, immersion nyiaj thiab immersion tin no tsib txheej txheem, cov hauv qab no yuav qhia ib tug los ntawm ib tug.
Cua kub leveling (tin spraying)
Cua kub leveling, tseem hu ua cua kub solder leveling (feem ntau hu ua tshuaj tsuag tin), nws yog coated nrog molten tin (lead) solder nyob rau saum npoo ntawm PCB thiab rhuab compressed cua (tshuab) tiaj tus txheej txheem, kom nws ua ib tug txheej ntawm ob qho tib si tooj liab oxidation kuj, tab sis kuj muab ib tug zoo solderability txheej txheej. Cov cua kub leveling ua ib qho tooj liab-tin intermetallic compound ntawm qhov sib txuas ntawm cov solder thiab tooj liab; PCBs yog leveled los ntawm huab cua kub kom tog rau hauv lub molten solder; rab riam cua tshuab cov kua nplaum ua ntej nws solidifies; cov riam cua minimizes solder mooning thiab tiv thaiv solder bridging ntawm tooj liab nto.
Organic Solderability Protectant (OSP)
OSP yog cov txheej txheem RoHS raws li kev kho saum npoo ntawm cov ntawv ci ntawm cov ntawv luam tawm (PCBs). OSP sawv cev rau Organic Solderability Preservatives thiab tseem hu ua Preflux. Yooj yim muab, OSP yog cov yeeb yaj kiab organic uas tau cog qoob loo ntawm qhov huv, liab qab tooj liab.
Cov yeeb yaj kiab no tiv taus oxidation, thermal shock thiab av noo thiab tiv thaiv cov tooj liab ntawm cov xeb ntxiv (oxidation lossis sulfurisation thiab lwm yam) hauv ib puag ncig ib puag ncig; Txawm li cas los xij, nyob rau hauv qhov kub kub tom ntej no, cov yeeb yaj kiab tiv thaiv no yuav tsum tau yooj yim thiab tshem tawm sai sai los ntawm cov flux kom cov tooj liab huv si tuaj yeem tam sim ntawd nrog cov molten solder los tsim cov khoom sib koom ua ke hauv lub sijhawm luv luv.
Tag nrho pawg thawj coj saib nickel-kub plating
Nickel kub plating yog ib txheej ntawm npib tsib xee plated ntawm PCB nto conductors ua ntej plating ib txheej kub, npib tsib xee plating yog tsuas yog los tiv thaiv diffusion ntawm kub thiab tooj liab. Niaj hnub no, muaj ob hom electroplated npib tsib xee kub: mos kub plating (ntshiab kub, kub nto tsis zoo li ci) thiab tawv kub plating (nqus thiab tawv nto, hnav-resistant, muaj lwm yam xws li cobalt, kub nto zoo li ci dua. ). Mos kub yog siv nyob rau hauv nti ntim thaum ntaus cov kab kub; hard kub yog tsuas yog siv nyob rau hauv tsis-soldering ntawm cov hluav taws xob interconnection.
Immersion kub
Immersion kub yog tuab, hluav taws xob suab txheej ntawm npib tsib xee-kub alloy qhwv nyob ib ncig ntawm cov tooj liab, uas tiv thaiv PCB rau lub sijhawm ntev; Tsis tas li ntawd nws muaj kev kam rau ib puag ncig uas lwm cov txheej txheem kho deg tsis muaj. Nws tseem tiv thaiv kev tawg ntawm tooj liab, uas yuav muaj txiaj ntsig zoo rau kev sib dhos tsis muaj txhuas.
Immersion tin
Raws li tag nrho cov tam sim no solders yog tin raws li, cov tin txheej tuaj yeem sib phim rau txhua yam ntawm cov solder. Cov txheej txheem tin hauv lub dab dej tsim ib lub tiaj tus tooj liab-tin intermetallic compound, ib qho cuab yeej uas ua rau lub dab dej tin zoo li zoo ib yam li kub-cua leveling yam tsis muaj qhov flatness taub hau ntawm kub-cua levelling; dab dej tin nplooj ntawv tsis tuaj yeem khaws cia ntev thiab yuav tsum tau sib sau ua ke hauv qhov kev txiav txim uas lawv tau poob.
Nyiaj immersion
Nruab nrab ntawm cov txheej txheem organic thiab electroless npib tsib xee / kub plating, cov txheej txheem yog yooj yim thiab ceev; nyiaj khaws cia zoo solderability txawm tias thaum tshav kub kub, av noo thiab paug, tab sis poob nws cov lustre. Immersion nyiaj tsis muaj lub zog zoo ntawm electroless npib tsib xee / kub kub vim tias tsis muaj npib tsib xee hauv qab txheej nyiaj.
Electroless npib tsib xee palladium kub
Lub palladium tiv thaiv corrosion vim kev hloov pauv hloov thiab npaj cov khoom rau kub deposition. Cov kub yog ze nrog palladium, muab kev sib cuag zoo.
Hard kub plating
Hard kub plating yog siv los txhim kho qhov hnav tsis kam ntawm cov khoom thiab ua kom muaj ntau qhov ntxig thiab tshem tawm.
