7. Electroless npib tsib xee / impregnated kub
Daim ntawv thov: Haum rau PCBAs nrog ntau cov khoom siv suab zoo (<0.63mm) and="" high="" coplanarity="" requirements.="" can="" also="" be="" used="" as="" a="" selective="" plating="" on="" osp="" surfaces,="" as="" per="">
Nqi: Siab.
Compatibility nrog txhuas-dawb: tau tshaj.
Lub neej txee: 12 lub hlis.
Solderability (wettability): siab.
Disadvantages: Risk ntawm embrittlement ntawm solder pob qij txha / soldering seams.
Kev pheej hmoo ntawm "dub disc" ua tsis tiav. Dub disc yog qhov tsis xws luag nrog qhov tshwm sim tsawg heev, uas yog qhov nyuaj rau kev kuaj xyuas nrog cov txheej txheem kev soj ntsuam ib txwm, tab sis qhov ua tsis tiav yog qhov kev puas tsuaj thiab yog li feem ntau tsis pom zoo rau kev kho mob zoo BGA pad nto.
Lub immersion kub txheej yog nyias nyias thiab tsis tuaj yeem tiv taus ntau tshaj 10 cov khoom siv thiab tshem tawm.
Cov chaw muab khoom siv: ntau dua.
8. Sunken nyiaj Im-ag
Daim ntaub ntawv: Haum rau PCBAs nrog ntau cov khoom siv zoo-pitch (<0.63mm) and="" relatively="" high="" coplanarity="">
Nqi: qis.
Compatibility nrog txhuas-dawb: tau tshaj.
Lub neej txee: 12 lub hlis.
Solderability (wettability): siab.
Disadvantages: muaj peev xwm interfacial microvoids.
Incompatible nrog kub-plated crimp connectors vim muaj kev sib txhuam siab ntawm ob.
Cov nyiaj-impregnated txheej yog nyias heev thiab tsis tuaj yeem tiv taus ntau tshaj 10 cov khoom siv thiab tshem tawm.
Cov cheeb tsam uas tsis yog soldered yog qhov kub thiab txias discoloration.
Yooj yim vulcanised (sulphur rhiab heev)
Muaj cov nyhuv Giovanni thiab qhov tob ntawm cov grooves feem ntau yuav plated nyob ib ncig ntawm 10μm.
Yooj yim rau creeping corrosion nyob rau hauv siab sulfur ib puag ncig vim yog cov tooj liab ntawm Giovanni grooves.
Cov chaw muab khoom siv: ntau dua.
9. Sink tin Im-Sn
Daim Ntawv Thov: Pom zoo rau backplanes (Back Plane). Nws tuaj yeem tau txais kev txaus siab crimp aperture loj, yooj yim ±{{0}}.05mm (± 0.002mil), ntxiv rau qee yam lubricating nyhuv, tshwj xeeb tshaj yog haum rau PCBA feem ntau rau crimp connectors
Tus nqi: qis (sib npaug rau ENIG)
Compatibility nrog txhuas-dawb: tau tshaj.
Lub neej txee: 12 lub hlis.
Solderability (wettability): siab.
Qhov tsis zoo: tsis pom zoo rau ib lub rooj tsavxwm (Line Card) vim muaj cov ntawv luam tawm thiab cov khoom xa rov qab tsawg
Lub tinned txheej nyob ze ntawm lub qhov ntsaws ntsaws qhov muag yuav ua rau tsis muaj xim tom qab reflow soldering. Qhov no yog vim lub fact tias lub solder tiv thaiv (feem ntau hu ua ntsuab roj) nyiam mus nkaum lub flux nyob rau hauv lub plug qhov thiab reacts nrog cov nyob ze tin txheej thaum txau tawm thaum lub sij hawm reflow soldering.
Muaj kev pheej hmoo ntawm tin whiskering. Qhov kev pheej hmoo ntawm tin whiskering nyob ntawm cov flux siv rau solder immersion, nrog rau qee cov fluxes ua cov txheej ntawm cov tin uas nquag plias thiab lwm yam tsawg dua.
Qee lub dab dej tin formulation fluxes tsis sib haum nrog solder resists thiab hnyav dua nyob rau hauv cov nqe lus ntawm solder tiv taus yaig, ua rau lawv tsis tsim nyog rau cov zoo solder tiv thaiv daim ntaub ntawv.
Cov chaw muab khoom siv: ntau dua.
10. Kub yaj tin txhuas
Daim ntaub ntawv: Feem ntau siv rau backplanes.
Nqi: Nruab nrab.
Compatibility nrog txhuas-dawb: incompatible.
Lub neej txee: 12 lub hlis.
Solderability (wettability): Nruab nrab. Qhov zoo tshaj plaws ntawm kub yaj yog tias nws yog corrosion resistant, tab sis cov solderability tsis zoo heev.
Disadvantages: tsis haum rau ib leeg boards (Line Card)
Tsis zoo coplanarity ntawm ncoo thiab solder ncoo, tsis haum rau PCBAs nrog siab coplanarity yuav tsum.
Rau plating nrog qhov sib txawv loj nyob rau hauv tus txheeb ze thickness, kom tau ib tug txaus siab ua tiav metallised aperture loj, yuav tsum tau them nyiaj rau qhov drilled aperture loj.
Cov chaw muab khoom siv: txwv.
11. Tshuaj lom neeg nickel-palladium/impregnated kub
Daim ntawv thov: Rau qhov chaw ruaj khov thiab ruaj khov tsis muaj kev pheej hmoo ntawm "dub yias". Muaj peev xwm hloov tau OSP lossis ENIG txheej txheej rau veneer daim ntaub ntawv.
Tus nqi: Nruab nrab mus rau siab (qis dua ENIG)
Compatibility nrog txhuas-dawb: tau tshaj.
Lub neej txee: 12 lub hlis.
Solderability (wettability): siab.
Qhov tsis zoo: Kev siv tsawg heev hauv PCB kev lag luam thiab kev paub me ntsis.
Cov chaw muab khoom siv: tsawg heev.
12. Xaiv cov tshuaj nickel / kub nrog OSP
Daim ntaub ntawv: tuaj yeem siv rau PCBAs xav tau cov chaw sib cuag thiab haum nrog cov khoom siv suab zoo. Nyob rau hauv daim ntawv thov no, OSP yog siv raws li ib tug heev txhim khu kev qha solderable txheej thiab ENIG yog siv raws li ib tug neeg kho tshuab kev sib cuag cheeb tsam, zoo li lub xov tooj ntawm tes keypad boards, qhov twg qhov chaw no feem ntau siv.
Nqi: nruab nrab mus rau siab.
Compatibility nrog txhuas-dawb: tau tshaj.
Lub neej txee: 6 lub hlis.
Solderability (wettability): qis.
Disadvantages: tus nqi siab.
ENIG tsis haum rau kev siv los ua ib qho av ntug plating rau kev taw qhia channel mounting raws li ENIG txheej yog nyias heev thiab tsis tiv taus kev txhuam.
Risk ntawm Giovanni nyhuv hauv OSP fluxes.
Cov chaw muab khoom siv: ntau dua.
